Processing Properties | Metric | English | Comments |
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Cure Time | 4320 - 18000 min @Temperature 23.9 °C |
72.0 - 300 hour @Temperature 75.0 °F |
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Master Bond EP21LVSP6 Two component epoxy for bonding, sealing, coating and encapsulating Product Description: Master Bond EP21LVSP6 is a two component epoxy compound for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at room temperature or more ra.. |