Polymer Property : Gel Time = 12.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Gel Time	12.0 min @Temperature 120 Â°C	12.0 min @Temperature 248 Â°F	Oven
Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu..
Gel Time	12.0 min @Temperature 210 °C	12.0 min @Temperature 410 °F
Hexcel® HexFlow® RTM 6 180°C Epoxy System for Resin Transfer Molding Monocomponent System HexFlow® RTM 6 is a monocomponent resin already degassed, specifically developed to fulfill the requirements of the aerospace and space industries in advanced resin transfer moulding (RTM) process...