Processing Properties | Metric | English | Comments |
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Pot Life | 600 min | 600 min | |
Huntsman HY 815 US Polyamide Approx. H+ equivalent weight 150. Mix Ratio with GY 6010 is 81.Comments/Applications: Solvent free, high molecular weight, low amine content. Superior adhesion, easily pigmented. Trade sale pain.. |
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Pot Life | 600 min | 600 min | |
Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug.. |
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Pot Life | 600 min | 600 min | |
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
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Pot Life | 600 min | 600 min | |
Dow Corning 3715 TOPCOAT A 2 part solventless silicone top coat that cures to a very hard and very low friction surface that is anti-soiling and dirt repellent. It is suitable as a top coat on high friction, blocking silico.. |