Processing Properties | Metric | English | Comments |
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Pot Life | 10080 min @Temperature 25.0 °C |
10080 min @Temperature 77.0 °F |
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Lord Adhesives Thermosetâ„¢ MS-330 Silicone Board Level Encapsulant LORD Thermosetâ„¢ MS-330 encapsulant is a one component silicone specifically designed for use on high-frequency devices including Bluetooth applications. This silicone encapsulant offers excelle.. |
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Pot Life | 10080 min @Temperature 23.0 °C |
10080 min @Temperature 73.4 °F |
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Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |