Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 26.4 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
SABIC Innovative Plastics LNP STAT-KON DE002ER PC LNP STAT-KON* DE002ER is a compound based on Polycarbonate resin containing 10% Carbon Fiber. Added features of this material include: Easy Molding. Mold Release, Electrically Conductive. |
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CTE, linear, Parallel to Flow | 26.5 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP STAT-KON DE002ER PC LNP STAT-KON* DE002ER is a compound based on Polycarbonate resin containing 10% Carbon Fiber. Added features of this material include: Easy Molding. Mold Release, Electrically Conductive. |
|||
CTE, linear, Parallel to Flow | 26.4 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
SABIC Innovative Plastics LNP STAT-KON DE002ER PC (Asia Pacific) LNP STAT-KON* DE002ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
CTE, linear, Parallel to Flow | 26.5 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP STAT-KON DE002ER PC (Asia Pacific) LNP STAT-KON* DE002ER is a compound based on Polycarbonate resin containing Carbon Fiber. Added features of this material include: Easy Molding. |
|||
CTE, linear, Parallel to Flow | 26.4 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ASTM E 831 |
SABIC Innovative Plastics LNP THERMOCOMP MF006SXP PP LNP THERMOCOMP* MF006SXP is a compound based on Polypropylene resin containing 30% Glass Fiber. Added features of this material include: Chemically Coupled. |
|||
CTE, linear, Parallel to Flow | 26.4 µm/m-°C @Temperature -40.0 - 40.0 °C |
14.7 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP MF006SXP PP LNP THERMOCOMP* MF006SXP is a compound based on Polypropylene resin containing 30% Glass Fiber. Added features of this material include: Chemically Coupled. |