Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.761 W/m-K | 5.28 BTU-in/hr-ft²-°F | |
Abatron AboWeld 8708-5 One-Component Structural/Dielectric Epoxy AboWeld 8708-5 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;.. |
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Thermal Conductivity | 0.761 W/m-K | 5.28 BTU-in/hr-ft²-°F | |
Abatron AboWeld 8708-7 One-Component Structural/Dielectric Epoxy AboWeld 8708-7 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FASTER high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulatin.. |
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Thermal Conductivity | 0.761 W/m-K | 5.28 BTU-in/hr-ft²-°F | |
Abatron AboWeld 8708-8 One-Component Structural/Dielectric Epoxy AboWeld 8708-8 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;.. |