Polymer Property : Thermal Conductivity = 40.0 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	5.76 - 6.48 W/m-K	40.0 - 45.0 BTU-in/hr-ft²-°F
Master Bond EP41S Fast Curing Epoxy Features Chemical Resistance Description: Master Bond EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and sealants with outstanding resistance to organic solven..
Thermal Conductivity	5.76 W/m-K	40.0 BTU-in/hr-ft²-°F
Cotronics Duralco™ 132 500°F (260°C) Aluminum Filled Epoxy Aluminum filled epoxy that cures at room temperature to form machinable, thermally conductive bond lines. High heat transfer. Can be supplied as a “non-sag” putty.Applications: heat tacking, hea..
Thermal Conductivity	5.76 W/m-K	40.0 BTU-in/hr-ft²-°F
Cotronics Duralco™ 133 500°F (260°C) Aluminum Filled Epoxy Two component, heat curing, aluminum filled epoxy suitable for high temperature tooling and a readily machinable repair or construction material. Similar to Duralco™ 132, but with a maximum servic..
Thermal Conductivity	5.76 W/m-K	40.0 BTU-in/hr-ft²-°F
Cotronics Duralco™ 135 500°F (260°C) Aluminum Filled Epoxy Similar to Duralco™ 134, but with ultra fine aluminum powder instead of ceramic powder to increase heat transfer rates.Applications: used in applications where excess heat build-up can cause serio..
Thermal Conductivity	5.76 W/m-K	40.0 BTU-in/hr-ft²-°F
Cotronics Resbond™ 903HP High Temperature Ceramic Adhesive, Hi-Bond Strength
Thermal Conductivity	5.76 W/m-K	40.0 BTU-in/hr-ft²-°F
Cotronics Resbond™ 906 High Temperature Ceramic Adhesive, High Expansion
Thermal Conductivity	5.76 W/m-K @Temperature 100 °C	40.0 BTU-in/hr-ft²-°F @Temperature 212 °F
Schmolz + Bickenbach MoldMAX XL® Copper Alloy Description: Brush Wellman’s MoldMAX XL® is a high strength copper mold alloy with good thermal conductivity. The alloy contains no beryllium and is available in sections as large as 12” thick. ..