Polymer Property : Thermal Conductivity = 0.178 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	0.178 W/m-K	1.24 BTU-in/hr-ft²-°F
Resinlab® EP965 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..
Thermal Conductivity	0.178 W/m-K	1.24 BTU-in/hr-ft²-°F
Resinlab® EP965 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting ..