Polymer Property : Thermal Conductivity = 0.147 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.147 W/m-K @Temperature 44.3 °C	1.02 BTU-in/hr-ft²-°F @Temperature 112 °F	ASTM C177
3M Scotch-Weld™ DP-105 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP105 Clear is a fast setting, very flexible 1:1 mix ratio epoxy adhesive/sealant. Its flexibility when cured makes it ideal for applications involving dissimilar s..
Thermal Conductivity	0.147 W/m-K	1.02 BTU-in/hr-ft²-°F
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..