Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 168 µm/m-°C | 93.3 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |