Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 212 µm/m-°C | 118 µin/in-°F | Above Tg |
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
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CTE, linear | 212 µm/m-°C | 118 µin/in-°F | Above Tg |
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use.. |