Polymer Property : Decomposition Temperature = 519 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	519 °C	966 °F	Degradation Temperature
Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400..