Polymer Property : Decomposition Temperature = 311 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	311 °C	592 °F	Degradation Temperature
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Decomposition Temperature	311 °C	592 °F	Onset; IPC TM-650 2.3.41
Arlon 38N High Performance Polyimide Low-Flow 38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow..