Thermal Properties | Metric | English | Comments |
---|---|---|---|
Deflection Temperature at 0.46 MPa (66 psi) | 338 °C | 640 °F | Flatw 80*10*4 sp=64mm; ISO 75/Bf |
SABIC Innovative Plastics LNP THERMOCOMP LC008E PEEK LNP* THERMOCOMP* LC008E is a compound based on Polyetheretherketone resin containing 40% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive. |
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Deflection Temperature at 0.46 MPa (66 psi) | 338 °C @Thickness 3.20 mm |
640 °F @Thickness 0.126 in |
unannealed; ASTM D648 |
SABIC Innovative Plastics LNP THERMOCOMP LC008E PEEK LNP* THERMOCOMP* LC008E is a compound based on Polyetheretherketone resin containing 40% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive. |
|||
Deflection Temperature at 0.46 MPa (66 psi) | 338 °C | 640 °F | Flatw 80*10*4 sp=64mm; ISO 75/Bf |
SABIC Innovative Plastics LNP THERMOCOMP LC008E PEEK (Asia Pacific) LNP* Thermocomp* LC008E is a compound based on Polyetheretherketone resin containing Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive. |
|||
Deflection Temperature at 0.46 MPa (66 psi) | 338 °C @Thickness 3.20 mm |
640 °F @Thickness 0.126 in |
unannealed; ASTM D648 |
SABIC Innovative Plastics LNP THERMOCOMP LC008E PEEK (Asia Pacific) LNP* Thermocomp* LC008E is a compound based on Polyetheretherketone resin containing Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive. |