Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 47.8 µm/m-°C @Temperature 24.0 - 250 °C |
26.6 µin/in-°F @Temperature 75.2 - 482 °F |
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Hexcel® HexPly® F655 Bismaleimide Resin HexPly® F655 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® F655 is a controlled flow polyimide res.. |