Polymer Property : Glass Transition Temp, Tg = 124 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	124 °C	255 °F	Ultimate Tg
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Glass Transition Temp, Tg	124 °C	255 °F	Dry
Hexcel® HexPly® F515 Epoxy Resin HexPly® F515 is an advanced, industrial grade, modified epoxy formulation designed for either vacuum bag or autoclave curing to offer very high laminate strengths, coupled with increased fracture t..