Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | 3.07 GPa @Temperature 23.9 °C |
445 ksi @Temperature 75.0 °F |
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Master Bond EP112 Low Viscosity Heat Curing Cycloaliphatic Epoxy Adhesive Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical & e.. |