Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Modulus | >= 2.07 GPa @Temperature 149 °C |
>= 300 ksi @Temperature 300 °F |
|
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer.. |