Mechanical Properties | Metric | English | Comments |
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Peel Strength | 1.17 kN/m | 6.70 pli | after solder float; IPC-TM-650.2.4.8 |
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free .. |
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Peel Strength | 1.17 kN/m | 6.70 pli | After 2 week exposure to 71°C, Vinyl-Gerfor MK foamed backed to Stainless Steel, 1 surface Bond |
3M Scotch-Weld™ 4491 Vinyl Bonding Cylinder Spray Adhesive Industrial grade, high performance, plasticizer resistant bulk spray adhesive formulated for bonding vinyl. The adhesive is available in a convenient, portable, no maintenance aerosol cylinder.Infor.. |
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Peel Strength | 1.17 kN/m | 6.70 pli | After 2 week exposure to 71°C, Vinyl-Gerfor MK foamed backed to Composite, 1 surface Bond |
3M Scotch-Weld™ 4491 Vinyl Bonding Cylinder Spray Adhesive Industrial grade, high performance, plasticizer resistant bulk spray adhesive formulated for bonding vinyl. The adhesive is available in a convenient, portable, no maintenance aerosol cylinder.Infor.. |
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Peel Strength | 1.17 kN/m | 6.70 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 |
Arlon 51N Lead-Free Compatible Epoxy Low-Flow 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stabili.. |
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Peel Strength | 1.17 kN/m | 6.70 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 |
Arlon 51N Lead-Free Compatible Epoxy Low-Flow 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stabili.. |
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Peel Strength | 1.17 kN/m | 6.70 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 |
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal .. |