Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength, Yield | 4.55 MPa @Temperature 71.1 °C |
660 psi @Temperature 160 °F |
Flatwise Tensile (Composite: Glass-Phenolic Core), Conditioning: 10 day Prebond Humidity + 14 Days at 160°F/100%RH |
Hexcel® Redux® 330K Epoxy film adhesives for the bonding and finishing of composites Redux 330 is a 350°F curing tough film adhesive which is ideally suited to structural bonding, composite to composite bonding, surface finishing, electromagnetic shielding and lightning strike appl.. |
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Tensile Strength, Yield | 4.55 MPa @Temperature 71.1 °C |
660 psi @Temperature 160 °F |
Flatwise Tensile (Composite: Glass-Phenolic Core), Conditioning: 10 day Prebond Humidity + 14 Days at 160°F/100%RH |
Hexcel® Redux® 330M Epoxy film adhesives for the bonding and finishing of composites Redux 330 is a 350°F curing tough film adhesive which is ideally suited to structural bonding, composite to composite bonding, surface finishing, electromagnetic shielding and lightning strike appl.. |