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Polymer Property : Tensile Stress = 205 MPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Tensile Stress 205 MPa
29700 psi
ASTM D1708
Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI)  (Unverified Data**)
Torlon 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics simil..
Tensile Stress 205 MPa
29700 psi
Lehmann & Voss LUVOCOM® 1-8070 VP Polyamide 66, with carbon fiber, lubricant modified, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Improved friction and wear beh..
Tensile Stress 205 MPa
29700 psi
Lehmann & Voss LUVOCOM® 3/CF/30/EG Polyamide 6, with carbon fiber, extrusion grade
Applications: Automotive industry, textile machinery, apparatus- and precision engineering.High-strength and stiff parts; low coefficient of expansion.dynamic stressElectrically conductive, suitable..
Tensile Stress 205 MPa
29700 psi
ASTM D1708
Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI), 30% Glass Fiber
Torlon® 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics s..
Tensile Stress 205 MPa
29700 psi
Lehmann & Voss LUVOCOM® 1301-0824 PPS, linear, with carbon fiber
Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High-strength and stiff parts with low creep.Electrically conductive, suitable for continuous disc..
Tensile Stress 205 MPa
29700 psi
Lehmann & Voss LUVOCOM® 1-7003 Polyamide 66, with carbon fiber and PTFE, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Electrically conductive, suita..
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