Polymer Property : Ball Indentation Hardness = 50800 psi Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Mechanical Properties	Metric	English	Comments
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage (dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Ball Indentation Hardness	350 MPa	50800 psi	dry; ISO 2039-1
EMS-Grivory Grivory® TSGL-60/4 black 9833 PA666-GF60 Product description: Grilon TSGL-60/4 black is based on a heat stabilized semicrystalline Polyamide PA66+PA6 and 60% long glass fibers. Grilon TSGL-60/4 black is characterized by the following key-p..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Ball Indentation Hardness	350 MPa	50800 psi	H 961/30; ISO 2039/P1
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..