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Polymer Property : Compressive Modulus = 276 ksi Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Compressive Modulus 1.90 GPa
276 ksi
ASTM D695
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate
CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin..
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