Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Compressive Modulus | 1.90 GPa | 276 ksi | ASTM D695 |
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin.. |