Polymer Property : Adhesive Bond Strength = 39.3 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	39.3 MPa	5700 psi	Cured property; Die Shear for Ag to Si, 0.07" x 0.07" IC
Aptek 6500-PMF Electrically conductive epoxy adhesive High purity, low outgassing, electrically conductive adhesiveAPTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic d..