Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 0.530 g/cc @Temperature 22.0 °C |
0.0191 lb/in³ @Temperature 71.6 °F |
Foamed/Cured Density; Cure Cycle: 20 min @ 175°C/347°F |
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic.. |