Polymer Property : Melt Index of Compound = 0.70 g/10 min Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Melt Index of Compound	0.70 g/10 min @Load 10.0 kg, Temperature 230 °C	0.70 g/10 min @Load 22.0 lb, Temperature 446 °F	ASTM D1238
3M Dyneon™ PVDF 1015/1001 Polyvinylidene Fluoride (discontinued **) Ultra-high molecular weight grade PVDFPowder gradeExcellent chemical resistance to a wide variety of aggressive fluids and solventsGood permeation resistanceExcellent strength and dimensional stabil..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 Â°C	0.70 g/10 min @Load 4.76 lb, Temperature 374 Â°F	ASTM D1238
Kuraray HYBRARÂ® H7125 Hydrogenated Thermoplastic Rubber Description: HYBRARÂ® is another in the series of new high performance thermoplastic rubbers developed by KURARAY using their unique isoprene technology. HYBRARÂ® is a special thermoplastic rubb..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..
Melt Index of Compound	0.70 g/10 min @Load 2.16 kg, Temperature 190 °C	0.70 g/10 min @Load 4.76 lb, Temperature 374 °F	ISO 1133
A. Schulman FORMION™ FI 131E Adhesive, Extrusion Grade DescriptionFormion® FI 131E is an adhesive grade extrusion product. It has been formulated to provide adhesion as a tie layer or resin modifier to bond Ionomer to polar and non polar substances, s..