Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 1.10e+6 cP @Temperature 25.0 °C |
1.10e+6 cP @Temperature 77.0 °F |
Spindle #7 @ 1rpm |
Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |