Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 1.045 microns | 0.04114 mil | 3000 rpm |
Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi.. |