Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.485 - 0.685 microns | 0.0191 - 0.0270 mil | 2000-4000 rpm |
Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl.. |