Polymer Property : Thickness = 0.280 microns Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	0.280 microns	0.0110 mil	3000 rpm
Dow SiLK™ I300 280 Semiconductor Dielectric Resin SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl..