Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.260 microns | 0.0102 mil | 3000 rpm |
Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with.. |