Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.475 - 0.676 microns | 0.0187 - 0.0266 mil | 2000-4000 rpm |
Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with.. |