Polymer Property : Thickness = 0.0126 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	0.230 - 0.320 microns	0.00906 - 0.0126 mil	2000-4000 rpm
Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with..