Polymer Property : Viscosity = 360500 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	360500 cP @Temperature 25.0 °C	360500 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond 933-1 Moisture Resistant Chip Encapsulant TRA-BOND 933-1 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..