Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 20 - 80 cP @Temperature 23.9 °C |
20 - 80 cP @Temperature 75.0 °F |
Part B |
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer.. |