Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 300000 - 1.00e+6 cP @Temperature 25.0 °C |
300000 - 1.00e+6 cP @Temperature 77.0 °F |
320 Resin; HBF, Helipath @ 5rpm, T-Bar Spindle D |
Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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Brookfield Viscosity | 300000 - 1.00e+6 cP @Temperature 25.0 °C |
300000 - 1.00e+6 cP @Temperature 77.0 °F |
309-2D Hardener; HBF with Helipath and T-C @ 5rpm |
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh.. |
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Brookfield Viscosity | 300000 - 1.00e+6 cP @Temperature 25.0 °C |
300000 - 1.00e+6 cP @Temperature 77.0 °F |
Mixed; HBF with Helipath and T-C @ 5rpm |
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh.. |