Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 79.0 cm | 31.1 in | 175°C/1000 psi |
Cookson Group Plaskon® SMT-B-1F Epoxy Molding Compound for PBGAs
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which mi.. |