Polymer Property : Spiral Flow = 51.2 in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	130 cm	51.2 in	175°C/1000 psi
Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provide..