Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 85.0 - 115 cm | 33.5 - 45.3 in | 177°C/1000 psi |
Cookson Group Plaskon® S-7LA Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices. It offers an alpha par.. |