Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 9.34 g/cc | 0.337 lb/in³ | |
AIM 35.7Sn/35.7Pb/28.6Bi Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |