- HOME
- POLYMER SEARCH
- Thermoset
- Filled/Reinforced Thermoset
- Epoxy, Encapsulating, Glass or Mineral Filled
- Sumitomo Bakelite North America Epiall® 2061B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Sumitomo Bakelite North America Epiall® 2061B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset |
| Manufacturer | Sumitomo Bakelite North America |
| Trade Name | Epiall® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Sumitomo Bakelite North America Epiall® 2061B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Epiall 2061B-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.Information provided by Sumitomo Bak North America, Inc.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Bulk Density | 0.800 g/cc | 0.0289 lb/in³ | ASTM D1895 |
| Density | 1.90 g/cc | 0.0686 lb/in³ | ASTM D792 |
| Water Absorption | 0.20 % @Temperature 50.0 °C, Time 173000 sec |
0.20 % @Temperature 122 °F, Time 48.0 hour |
ASTM D570 |
| Linear Mold Shrinkage | 0.0030 - 0.0050 cm/cm | 0.0030 - 0.0050 in/in | ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Barcol | 70 | 70 | ASTM D2583 |
| Tensile Strength at Break | 90.0 MPa | 13100 psi | ASTM D638 |
| Flexural Strength | 138 MPa | 20000 psi | at rupture; ASTM D790 |
| Flexural Modulus | 15.9 GPa | 2310 ksi | ASTM D790 |
| Compressive Strength | 230 MPa | 33400 psi | ASTM D695 |
| Izod Impact, Notched | 0.370 J/cm | 0.693 ft-lb/in | ASTM D256 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 19.4 µm/m-°C | 10.8 µin/in-°F | post baked; ASTM E831 |
| 28.5 µm/m-°C | 15.8 µin/in-°F | as molded; ASTM E831 | |
| CTE, linear, Transverse to Flow | 26.4 µm/m-°C | 14.7 µin/in-°F | post baked; ASTM E831 |
| 40.9 µm/m-°C | 22.7 µin/in-°F | as molded; ASTM E831 | |
| Maximum Service Temperature, Air | 130 °C | 266 °F | UL Temperature Index; UL 746B |
| Deflection Temperature at 1.8 MPa (264 psi) | 165 °C | 329 °F | As Molded; ASTM D648A |
| Flammability, UL94 | V-0 @Thickness 1.60 mm |
V-0 @Thickness 0.0630 in |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Dielectric Constant | 3.8 @Frequency 1.00e+6 Hz |
3.8 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
| Dielectric Strength | 13.2 kV/mm @Frequency 60.0 Hz |
335 kV/in @Frequency 60.0 Hz |
step-by-step, wet; ASTM D149 |
| 13.6 kV/mm @Frequency 60.0 Hz |
345 kV/in @Frequency 60.0 Hz |
short time, wet; ASTM D149 | |
| Dissipation Factor | 0.016 @Frequency 1.00e+6 Hz |
0.016 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
| Arc Resistance | 180 sec | 180 sec | ASTM D495 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Black | |
| Form | Granular | |
| Molding Method | Compression | |
| Transfer |
Users viewing this material also viewed the following:
- Solvay Specialty Polymers Algoflon® 15GL+3Mos PTFE; Glass Fiber/Molybdenum Disulphide Filled (discontinued **
- Kingfa JH720 G10 10% Glass Fiber Reinforced PC
- Solvay TECHNYLSTARâ„¢ S 216 V35 PA6, 35% glass filled, Conditioned
- SABIC Innovative Plastics LNP LUBRICOMP RFL33 PA 66 (Asia Pacific)
- SABIC Innovative Plastics LNP STAT-KON RX04031 PA 66 (Europe-Africa-Middle East)
- A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound
- Dow Corning Z-6040® SILANE
- 3M Safety-Walk™ 630 Safety Yellow Slip-Resistant General Purpose Tapes and Treads
- ExxonMobil Escorene® HD-8760 LHDPE Rotational Molding Grade (discontinued **)
Copyright © lookpolymers.com All Rights Reserved