Rogers Corporation Ultralam® 3908 Liquid Crystalline Polymer Circuit Material

ULTRALAM® 3908 bondply is used as a bonding medium between copper and the dielectric material. This product was developed specifically for multi-layer substrate constructions. This adhesiveless film is well suited for high speed and high frequency applications in telecommunication network equipment, high-speed computer data links and other high performance applications.Features and Benefits:Excellent electrical properties - Stable dielectric constant for minimal cross talk between signal layers, allows use of thinner bonding film with very minimal signal lossLow modulus - Bends easily for flex applications, offers design flexibility and minimizes space requirementsExtremely low moisture absorption - maintains stable electrical, mechanical and dimensional propertiesFlame resistant - halogen-free, UL94VTM/0 (meets requirements for consumer products)Typical Applications:All LCP flex interconnections - high speed switches and routers, Backplane-to-backplane, Data links, Card-to-cardHybrid substrates - Handheld and RF devicesInformation provided by Rogers Corporation.