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Resin Technology Group TIGA 920H Flexible Silver Conductive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resin Technology Group
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resin Technology Group TIGA 920H Flexible Silver Conductive.pdf
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Material Notes:
100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibility, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including metals, ceramics and plastic laminates. TIGA 920-H cures at room temperature and can be used as a flexible “cold solder” for heat sensitive parts. It can also be used in the assembly and repair of flexible circuits, electrical components and electronic shielding.Information provided by Resin Technology Group.
Physical Properties Metric English Comments
Specific Gravity 2.90 g/cc
2.90 g/cc
Solids Content 100 %
100 %
Reactive
Mechanical Properties Metric English Comments
Hardness, Shore D 55
55
Shear Strength >= 3.45 MPa
>= 500 psi
Lap, Au/Au
>= 3.45 MPa
>= 500 psi
Lap, Kaptona
>= 6.89 MPa
>= 1000 psi
Lap, Al/Al
Thermal Properties Metric English Comments
Thermal Conductivity 1.55 W/m-K
10.7 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 110 °C
230 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Cured 2 hours at 65°C
<= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Cured 1 hour at 110°C
0.050 ohm-cm
0.050 ohm-cm
Cured 12-24 hours at 25°C
Processing Properties Metric English Comments
Pot Life 180 min

@Temperature 25.0 °C
180 min

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Viscosity Smooth paste
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