Reltek BONDiT™ HM-502 Coating, Sealant, Adhesive System

Category	Polymer , Adhesive
Manufacturer	Reltek LLC
Trade Name	BONDiT™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Reltek BONDiT™ HM-502 Coating, Sealant, Adhesive System.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

A protective coat for most metal, glass, and ceramic materials for use against corrosion and other chemical attacks. Useful against fungi growth. Bondit HM-502 is a thermoplastic emulsion system.Information provided by Reltek LLC

Physical Properties	Metric	English	Comments
Density	0.955 g/cc	0.0345 lb/in³
Moisture Absorption at Equilibrium	0.040 % @Temperature 40.0 °C	0.040 % @Temperature 104 °F	100% RH
Water Vapor Transmission	<= 35.7 g/m²/day @Temperature 38.0 °C	<= 2.30 g/100 in²/day @Temperature 100 °F	ASTM E-96
Oxygen Transmission	138 cc-mm/m²-24hr-atm @Temperature 23.0 °C	350 cc-mil/100 in²-24hr-atm @Temperature 73.4 °F	ASTM D1434
Viscosity	850 cP	850 cP
Environmental Stress Crack Resistance	>= 200 hour	>= 200 hour

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	42	42	ASTM D2240
Tensile Strength at Break	6.21 MPa	900 psi	ASTM D638
Elongation at Break	350 %	350 %	ASTM D638
2% Secant Modulus	0.0221 GPa	3.20 ksi	ASTM D790

Thermal Properties	Metric	English	Comments
Crystallization Temperature	75.0 °C	167 °F
Brittleness Temperature	-23.0 °C	-9.40 °F	ASTM D746

Descriptive Properties	Value	Comments
Approximate reverse impact	24
Color	Clear
Fungi Resistance	No Growth
Insulation Resistance (V/mil)	500
Thermal Shock	No effect

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