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Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer

Category Polymer
Manufacturer Parker Chomerics Tecknit
Trade Name Teckfip™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer.pdf
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Material Notes:
Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compound has been optimized for its overall shielding effectiveness, high cycling applications are not recommended for this material. This compound is ideally designed for projects that will not get opened and closed frequently, such as mobile phones.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 1.794 - 2.427 g/cc
1.794 - 2.427 g/cc
Mechanical Properties Metric English Comments
Hardness, Shore A 50 - 60
50 - 60
Tensile Strength >= 1.08 MPa
>= 157 psi
Elongation at Break 31 %
31 %
Peel Strength >= 9.00 kN/m
>= 51.4 pli
Compression Set 10 - 25 %
10 - 25 %
57 %

@Temperature 70.0 °C,
Time 79200 sec
57 %

@Temperature 158 °F,
Time 22.0 hour
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.018 ohm-cm
0.018 ohm-cm
Surface Resistance <= 0.010 ohm
<= 0.010 ohm
Processing Properties Metric English Comments
Dry Time >= 0.100 hour
>= 0.100 hour
Tack Free
Cure Time <= 1440 min
<= 24.0 hour
Shelf Life 1.00 Month
1.00 Month
Syringe
6.00 Month
6.00 Month
Cartridge
Descriptive Properties Value Comments
Color Beige
Filler Silver/Copper
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