Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer

Category	Polymer
Manufacturer	Parker Chomerics Tecknit
Trade Name	Teckfip™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compound has been optimized for its overall shielding effectiveness, high cycling applications are not recommended for this material. This compound is ideally designed for projects that will not get opened and closed frequently, such as mobile phones.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	1.794 - 2.427 g/cc	1.794 - 2.427 g/cc

Mechanical Properties	Metric	English
Hardness, Shore A	50 - 60	50 - 60
Tensile Strength	>= 1.08 MPa	>= 157 psi
Elongation at Break	31 %	31 %
Peel Strength	>= 9.00 kN/m	>= 51.4 pli
Compression Set	10 - 25 %	10 - 25 %
	57 % @Temperature 70.0 °C, Time 79200 sec	57 % @Temperature 158 °F, Time 22.0 hour

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.018 ohm-cm	0.018 ohm-cm
Surface Resistance	<= 0.010 ohm	<= 0.010 ohm

Processing Properties	Metric	English	Comments
Dry Time	>= 0.100 hour	>= 0.100 hour	Tack Free
Cure Time	<= 1440 min	<= 24.0 hour
Shelf Life	1.00 Month	1.00 Month	Syringe
	6.00 Month	6.00 Month	Cartridge

Descriptive Properties	Value	Comments
Color	Beige
Filler	Silver/Copper

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