| Category | Polymer , Adhesive |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-FORM |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-FORM 5528 Conductive Form-In-Place Gaskets.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.40 g/cc | 3.40 g/cc | ASTM D792 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore A | 40 | 40 | |
| Tensile Strength at Break | 0.862 MPa | 125 psi | ASTM D412 |
| Elongation at Break | 100 % | 100 % | ASTM D412 |
| Compression Set | 45 % @Temperature 70.0 °C, Time 79200 sec |
45 % @Temperature 158 °F, Time 22.0 hour |
ASTM D395 Method B |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 85.0 °C | 185 °F | |
| Flammability, UL94 | V-0 | V-0 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 0.0050 ohm-cm | 0.0050 ohm-cm | Chomerics MAT-1002 |
| Shielding Effectiveness | >= 70 dB @Frequency 2.00e+8 - 1.20e+10 Hz |
>= 70 dB @Frequency 2.00e+8 - 1.20e+10 Hz |
Modified IEEE-299 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 18.0 min @Temperature 22.0 °C |
0.300 hour @Temperature 71.6 °F |
50% RH; Tack Free Time |
| 240 min @Temperature 22.0 °C |
4.00 hour @Temperature 71.6 °F |
50% RH; Handling Time | |
| 1440 min @Temperature 22.0 °C |
24.0 hour @Temperature 71.6 °F |
50% RH; Full Cure | |
| Shelf Life | 6.00 Month @Temperature -12.0 - -8.00 °C |
6.00 Month @Temperature 10.4 - 17.6 °F |
Chomerics |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Adhesion | 3.9 N/cm | Trivalent Chromate Coating on Aluminum; Chomerics WI 1038 |
| Cure Mechanism | Moisture | |
| Filler | Ag/Cu | |
| Number of Components | 1 | |
| Resin System | Silicone |