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Parker Chomerics CHO-BOND 2165 Polyurethane Sealant

Category Polymer , Thermoset , Polyurethane, TS
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 2165 Polyurethane Sealant.pdf
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Material Notes:
Conductive sealant is a stabilized copper filled, two component polyurethane. It has excellent electrical and physical properties for aerospace and military applications. CHO-BOND® 2165 sealant is highly resistant to aircraft fluids and to corrosion.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.85 g/cc
2.85 g/cc
ASTM 0792
Solids Content >= 95 %
>= 95 %
ASTM D1259
Mechanical Properties Metric English Comments
Hardness, Shore A 73
73
ASTM D2240
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 85.0 °C
185 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.0070 ohm-cm
0.0070 ohm-cm
95-40-5555
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 125 °C
0.500 hour

@Temperature 257 °F
after 4 hrs at RT
120 min

@Temperature 93.0 °C
2.00 hour

@Temperature 199 °F
after 4 hrs at RT
10100 min

@Temperature 24.0 °C
168 hour

@Temperature 75.2 °F
Shelf Life 9.00 Month
9.00 Month
unopened
Descriptive Properties Value Comments
Mix Ratio 100 to 7.021
A:B
Tack-Free Time 4 hrs at RT, 50% RH
Working Life 1 hr
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