- HOME
- POLYMER SEARCH
- Thermoset
- Silicone
- Parker Chomerics CHO-BOND 1067, Part A Silicone Resin Mixture
Parker Chomerics CHO-BOND 1067, Part A Silicone Resin Mixture
| Category | Polymer , Thermoset , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 1067, Part A Silicone Resin Mixture.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 1.00 g/cc | >= 1.00 g/cc | |
| Solubility in Water | 0.00 % | 0.00 % | Insoluble |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | White | |
| Physical Form | White Paste with Acetic acid odor | |
| Silica, Trimethylated wt. % Max | 10 | |
| Silicone Resin % | >80 | |
| Titanium Dioxide 13463-67-7 % | <10 |
Users viewing this material also viewed the following:
- Omnia Plastica Akulon® PA6 G.Oil Omniamid Oil - Dry
- Polykemi AB SCANMID 6 B12^ F25 FR6 Nylon 6, Glass Fiber Reinforced, Flame Retardant
- Lucent Polymers CPP-230 Polypropylene, 30% Calcium Carbonate Filled, Impact Modified
- Teknor Apex Synres® PP G20 62 Polypropylene, Glass Reinforced
- A. Schulman POLYFORT™ PP 2173HU Toyota High Impact Copolymer Polypropylene
- Hexcel® Redux® 322U Modified epoxy film adhesive (0.06 psf)
- 3M 394 Vent Tape
- BASF Ultramid® S3WG7 Balance 35% Glass Filled PA 610 (Dry)
- Solvay Engineered Polymers DEXPRO® R210 TPV - High-Impact Polypropylene (discontinued **)
- Karina 837-10/37-A-ERYB-LMP White PVC Compound
Copyright © lookpolymers.com All Rights Reserved