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Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg

Category Polymer , Thermoset , Epoxy
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg.pdf
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Material Notes:
The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Features and Benefits:Lead-Free Assembly CompatibleTg >190ºC, robust thermal stabilityHigh Speed and Low Loss PropertiesCAF ResistantSI (Signal Integrity) optionHigh-Tg FR-4 processingApplications/Qualifications:Lead-Free AssembliesFine-Line MultilayersBackplanesSurface-Mount MultilayersBGA MultilayersSIPsMCM-LsDirect Chip AttachNetwork StorageWireless Communications InfrastructureHigh Speed ComputingInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.90 g/cc
0.0686 lb/in³
50% Resin Content; Internal Method
Water Absorption 0.090 %
0.090 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 23.4 GPa
3400 ksi
Y; ASTM D3039
28.3 GPa
4100 ksi
X; ASTM D3039
Poissons Ratio 0.14
0.14
Y; ASTM D3039
0.16
0.16
X; ASTM D3039
Peel Strength 1.53 kN/m
8.70 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.61 kN/m
9.20 pli
after solder float; IPC-TM-650.2.4.8
1.63 kN/m
9.30 pli
after exposure to process solutions; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 12.0 - 15.5 µm/m-°C

@Temperature -40.0 - 125 °C
6.67 - 8.62 µin/in-°F

@Temperature -40.0 - 257 °F
X/Y; IPC-TM-650.2.4.41
60.05 µm/m-°C

@Temperature 50.0 - 190 °C
33.36 µin/in-°F

@Temperature 122 - 374 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
260.21 µm/m-°C

@Temperature 190 - 260 °C
144.56 µin/in-°F

@Temperature 374 - 500 °F
Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 1.21 J/g-°C
0.290 BTU/lb-°F
ASTM E1461
Thermal Conductivity 0.300 - 0.500 W/m-K
2.08 - 3.47 BTU-in/hr-ft²-°F
ASTM E1461
Glass Transition Temp, Tg 180 °C
356 °F
TMA; IPC-TM-650.2.4.24c
190 °C
374 °F
DSC; IPC-TM-650.2.4.25c
210 °C
410 °F
DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 370 °C
698 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
1.00e+14 ohm-cm
1.00e+14 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohm
1.00e+12 ohm
E - 24/125; IPC-TM-650.2.5.17.1
1.00e+14 ohm
1.00e+14 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant 3.6

@Frequency 1.00e+10 Hz
3.6

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
3.7

@Frequency 1.00e+10 Hz
3.7

@Frequency 1.00e+10 Hz
Split Post Cavity
3.7

@Frequency 1.00e+9 Hz
3.7

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 57.9 kV/mm
1470 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.0080

@Frequency 2.50e+9 Hz
0.0080

@Frequency 2.50e+9 Hz
Split Post Cavity
0.0080

@Frequency 1.00e+10 Hz
0.0080

@Frequency 1.00e+10 Hz
Split Post Cavity
Arc Resistance 65 sec
65 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Methylene Chloride Resistance (% Weight Change) 1
IPC-TM-650.2.3.4.3
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) >60
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 3.6
50ºC to 260ºC; IPC-TM-650.2.4.41
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