Material Notes:
TSE3261-G is a one-component heat curable silicone adhesive designed for high temperature applications. TSE3261-G adheres well to a variety of substrates such as metals, plastics, ceramics and glass without the use of a primer.Cured properties for specimen cured 1 hour at 150°C.Key Performance Properties: Ready to use - one componentExcellent high temperature resistanceHeat accelerated cureExcellent adhesive properties; primerless adhesion to many types of substratesGray colorNon corrosive to metals Applications: Sealing and bonding for high temperature applicationsHeatersSteam IronsMicrowave OvensSealing, bonding and potting for electrical appliances and electronic parts. GE Silicones became a part of Momentive Performance Materials in 2006.